AEPAPS

Auger electron appearance potential spectroscopy

AES

Auger electron spectroscopy

AFM

Atomic force microscopy

APS

Appearance potential spectroscopy

AREAS

Angle-resolved Auger electron spectroscopy

ARXPD

Angle-resolved x-ray photoemission/photoelectron diffraction

ARXPS

Angle-resolved x-ray photoelectron spectroscopy

ARUPS

Angle-resolved ultraviolet spectroscopy

BIS

Bremmstrahlung isochromat spectroscopy (same as IPES)

CHA

Concentric hemispherical analyzer

CITS

Current imaging tunneling spectroscopy

CMA

Cylindrical mirror analyzer

CPD

Contact potential difference

CVD

Chemical vapor deposition

DAPS

Disappearance potential spectroscopy

DSIMS

Dynamic secondary ion mass spectrometry

EAPFS

Extended appearance potential spectroscopy

EELS

Electron energy loss spectroscopy (same as ELS)

ELS

Energy loss spectroscopy (same as EELS)

ESCA

Electron spectroscopy for chemical analysis (same as XPS)

ESD

Electron stimulated desorption

ESDIAD

Electron stimulated desorption ion angular distributions

ESFD

Electron stimulated field desorption

EXAFS

Extended x-ray absorption fine structure

EXELFS

Extended energy loss fine structure

FEM

Field emission microscopy

FIM

Field ionization microscopy

FTRAIS

Fourier transform reflection-absorption infrared spectroscopy

HAD

Helium atom diffraction

HAS

Helium atom scattering

HEIS

High energy ion scattering

HREELS

High resolution electron energy loss spectroscopy

HV

High vacuum/high voltage

IMBS

Inelastic molecular beam scattering

INS

Inelastic neutralization spectroscopy

IPES

Inverse photoemission spectroscopy (same as BIS)

IRAS

Infrared reflection-absorption spectroscopy (same as RAIRS)

ISS

Ion scattering spectroscopy

KRIPES

k-resolved inverse photoemission spectroscopy

LEED

Low energy electron diffraction

LEIS

Low energy ion scattering

LEPD

Low energy positron diffraction

LITD

Laser-induced thermal desorption

LFM

Lateral force microscopy

MBE

Molecular beam epitaxy

MEED

Medium energy electron diffraction

MEIS

Medium energy ion scattering

MOCVD

Metal-organic chemical vapor deposition

NEXAFS

Near-edge x-ray absorption fine structure (same as XANES)

PEEM

Photoemission electron microscopy

PES

Photoemission spectroscopy

PSD

Photon stimulated desorption/position sensitive detector

QMS

Quadrupole mass spectrometer

RAIRS

Reflection-absorption infrared spectroscopy (same as IRAS)

RBS

Rutherford backscattering spectroscopy

RFA

Retarding field analyzer

RGA

Residual gas analyzer

RHEED

Reflection high energy electron diffraction

SAM

Scanning Auger microprobe

SEM

Scanning electron microscopy

SERS

Surface-enhanced Raman spectroscopy

SEXAFS

Surface extended x-ray absorption fine structure

SFG

Sum frequency generation

SHG

Second harmonic generation

SIMS

Secondary ion mass spectrometry

SPALEED

Spot-profile analysis low energy electron diffraction

SPLEED

Spin-polarized low energy electron diffraction

SPIES

Surface Penning ionization electron spectroscopy

SPM

Scanning probe microscopy

SSIMS

Static secondary ion mass spectrometry

STM

Scanning tunneling microscopy

STS

Scanning tunneling spectroscopy

SXAPS

Soft x-ray appearance potential spectroscopy

SXRD

Standing x-ray diffraction

SXW

Standing x-ray wavefield absorption (same as XSW)

TDS

Thermal desorption spectroscopy (same as TPD and TPR)

TEAS

Thermal energy atom scattering

TEM

Transmission electron microscopy

TPD

Temperature programmed desorption (same as TPR and TDS)

TPR

Temperature programmed reaction (same as TPD and TDS)

UHV

Ultrahigh vacuum

UPS

Ultraviolet photoelectron/photoemission spectroscopy

XANES

X-ray absorption near-edge structure (same as NEXAFS)

XPS

X-ray photoelectron spectroscopy (same as ESCA)

XRD

X-ray diffraction

XSW

X-ray standing wavefield absorption (same as SXW)